The Japanese mobile network operator is to provide a range of stickers compatible with the Edy, Waon and Nanaco payments services from February, enabling iPhone 4 users to make use of Japan’s well established mobile payments services for the first time.
Japanese mobile network operator Softbank is to introduce a range of polyurethane stickers that attach to the back of an iPhone 4 to enable the phone’s users to make use of the country’s widely adopted mobile payments services for the first time.
The stickers, which are compatible with the iPhone 4 Bumpers issued to many users to mitigate the handset’s well-documented antenna problems, measure 55.4mm by 112mm long and are designed to be affixed neatly to the back of the phone. Different versions for each of the main prepaid payments services available on phones equipped with a built-in Osaifu-Keitai mobile contactless payments chip — Edy, Waon and Nanaco — will be available.
The stickers, described by Softbank as ‘seals’, will be available to purchase from February 2011 at a cost of 2,980 yen (US$35).
Next: Visit the NFCW Expo to find new suppliers and solutions
I think softbank have an interesting short-term solution; but I hope they're not relying on it in the long-term.
hi x man. i hav one question. i know that sticker form factor is short term biz right. but nfc handset spread speed will be slow into market also.
how do u think this ?
…iPhone 5 will have an NFC chip baked in… Count on it.